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. Ed(S): Joachim, Christian; Baillin, Xaivier; Poupon, Gilles - Nanopackaging: from Nanomaterials to the Atomic Scale - 9783319211930 - V9783319211930
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Nanopackaging: from Nanomaterials to the Atomic Scale

€ 194.08
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Description for Nanopackaging: from Nanomaterials to the Atomic Scale hardcover. Editor(s): Joachim, Christian; Baillin, Xaivier; Poupon, Gilles. Series: Advances in Atom and Single Molecule Machines. Num Pages: 197 pages, 77 black & white illustrations, 47 colour illustrations, 9 black & white tables, biograph. BIC Classification: TBN. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 13. Weight in Grams: 467.
This book is a first attempt to merge two different communities: scientists and technologists. Therefore, it is not a general overview covering all the fields of nanopackaging, but is mainly focused on two topics. The first topic deals with atomic scale devices or circuit requirements, as well as related recent technological developments; for example, surface science engineering and atomic scale interconnects studies. The second main part of the book brings CNT nano-materials solutions for resolving interconnect or thermal management problems in microelectronics device packaging. This book is not just useful for those who attended the International Workshop on Nanopackaging in ... Read more

Product Details

Format
Hardback
Publication date
2015
Publisher
Springer International Publishing AG Switzerland
Number of pages
197
Condition
New
Series
Advances in Atom and Single Molecule Machines
Number of Pages
189
Place of Publication
Cham, Switzerland
ISBN
9783319211930
SKU
V9783319211930
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15

About . Ed(S): Joachim, Christian; Baillin, Xaivier; Poupon, Gilles
Xavier BAILLIN is CEA senior expert in the field of micro devices packaging. After twenty years dedicated to address basic research focused on the relationship between microstructure and mechanical behavior of different industrial alloys, he joined Léti in 2003 where he has been in charge of wafer level packaging activity. He has specially contributed to the development of technologies dedicated ... Read more

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