Dry Etching for Very Large Scale Integration
Roosmalen, A. J. Van; Baggerman, J. A. G.; Brader, S. J. H.
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Description for Dry Etching for Very Large Scale Integration
Hardback. Series: Updates in Applied Physics & Electrical Technology S. Num Pages: 254 pages, biography. BIC Classification: PHFP. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 254 x 178 x 19. Weight in Grams: 1580.
This book has been written as part of a series of scientific books being published by Plenum Press. The scope of the series is to review a chosen topic in each volume. To supplement this information, the abstracts to the most important references cited in the text are reprinted, thus allowing the reader to find in-depth material without having to refer to many additional publications. This volume is dedicated to the field of dry (plasma) etching, as applied in silicon semiconductor processing. Although a number of books have appeared dealing with this area of physics and chemistry, these all deal ... Read more
This book has been written as part of a series of scientific books being published by Plenum Press. The scope of the series is to review a chosen topic in each volume. To supplement this information, the abstracts to the most important references cited in the text are reprinted, thus allowing the reader to find in-depth material without having to refer to many additional publications. This volume is dedicated to the field of dry (plasma) etching, as applied in silicon semiconductor processing. Although a number of books have appeared dealing with this area of physics and chemistry, these all deal ... Read more
Product Details
Format
Hardback
Publication date
1991
Publisher
Springer Science+Business Media United States
Number of pages
254
Condition
New
Series
Updates in Applied Physics & Electrical Technology S.
Number of Pages
237
Place of Publication
, United States
ISBN
9780306438356
SKU
V9780306438356
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
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