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Semiconductor Wafer Bonding
Q.-Y. Tong
€ 234.73
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Description for Semiconductor Wafer Bonding
Hardcover. Though there has been a lot of scattered information on specific aspects of wafer bonding--a technique for welding semiconductor wafers together without using glue, this is one of the first practical works to bring together a broad range of information into a coherent overview of the field. Series: ECS Series of Texts and Monographs. Num Pages: 320 pages, illustrations. BIC Classification: PHFC; PNRH; TGMT; TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 243 x 165 x 23. Weight in Grams: 598.
A one-stop resource on all aspects of semiconductor wafer bonding for materials scientists and electrical engineers
Semiconductor Wafer Bonding addresses the entire spectrum of mainstream and likely future applications of wafer bonding. It examines all of the important issues surrounding this technology, including basic interactions between flat surfaces, the influence of particles, surface steps and cavities, surface preparation and room-temperature wafer bonding, thermal treatment of bonded wafer pairs, and much more.
This unique, one-stop resource consolidates information previously available only by time-consuming searches through technical journals, proceedings, and book chapters for more than 1,000 ... Read more
A one-stop resource on all aspects of semiconductor wafer bonding for materials scientists and electrical engineers
Semiconductor Wafer Bonding addresses the entire spectrum of mainstream and likely future applications of wafer bonding. It examines all of the important issues surrounding this technology, including basic interactions between flat surfaces, the influence of particles, surface steps and cavities, surface preparation and room-temperature wafer bonding, thermal treatment of bonded wafer pairs, and much more.
This unique, one-stop resource consolidates information previously available only by time-consuming searches through technical journals, proceedings, and book chapters for more than 1,000 ... Read more
Product Details
Format
Hardback
Publication date
1998
Publisher
John Wiley & Sons Inc United States
Number of pages
320
Condition
New
Series
ECS Series of Texts and Monographs
Number of Pages
320
Place of Publication
, United States
ISBN
9780471574811
SKU
V9780471574811
Shipping Time
Usually ships in 7 to 11 working days
Ref
99-50
About Q.-Y. Tong
Q.-Y. TONG is Professor and Director of the Microelectronics Center at Southeast University in Nanjing, China, and Adjunct Professor at Duke University's School of Engineering. Currently, he is also the manager of the Wafer Bonding Lab at the Research Triangle Institute. He was formerly a consultant at the Max-Planck-Institute of Microstructure Physics. U. GÖSELE, PhD, is Director ... Read more
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