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Reduced Thermal Processing for ULSI
Roland A. . Ed(S): Levy
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Description for Reduced Thermal Processing for ULSI
Paperback. Proceedings of a NATO ASI held in Boca Raton, Florida, June 20-July 1, 1988 Editor(s): Levy, Roland A. Series: NATO Science Series B. Num Pages: 450 pages, biography. BIC Classification: PHF; PHFC; PNFS. Category: (G) General (US: Trade). Dimension: 244 x 170 x 23. Weight in Grams: 780.
As feature dimensions of integrated circuits shrink, the associated geometrical constraints on junction depth impose severe restrictions on the thermal budget for processing such devices. Furthermore, due to the relatively low melting point of the first aluminum metallization level, such restrictions extend to the fabrication of multilevel structures that are now essential in increasing packing density of interconnect lines. The fabrication of ultra large scale integrated (ULSI) devices under thermal budget restrictions requires the reassessment of existing and the development of new microelectronic materials and processes. This book addresses three broad but interrelated areas. The first area focuses on the ... Read more
As feature dimensions of integrated circuits shrink, the associated geometrical constraints on junction depth impose severe restrictions on the thermal budget for processing such devices. Furthermore, due to the relatively low melting point of the first aluminum metallization level, such restrictions extend to the fabrication of multilevel structures that are now essential in increasing packing density of interconnect lines. The fabrication of ultra large scale integrated (ULSI) devices under thermal budget restrictions requires the reassessment of existing and the development of new microelectronic materials and processes. This book addresses three broad but interrelated areas. The first area focuses on the ... Read more
Product Details
Format
Paperback
Publication date
2011
Publisher
Springer-Verlag New York Inc. United States
Number of pages
450
Condition
New
Series
NATO Science Series B
Number of Pages
450
Place of Publication
New York, NY, United States
ISBN
9781461278573
SKU
V9781461278573
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
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