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Rapid Thermal Processing of Semiconductors
Borisenko, Victor E.; Hesketh, Peter J.
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Description for Rapid Thermal Processing of Semiconductors
Paperback. Series: Microdevices. Num Pages: 358 pages, biography. BIC Classification: PHFC; PNFS; TGM. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 20. Weight in Grams: 587.
Rapid thermal processing has contributed to the development of single wafer cluster processing tools and other innovations in integrated circuit manufacturing environments. Borisenko and Hesketh review theoretical and experimental progress in the field, discussing a wide range of materials, processes, and conditions. They thoroughly cover the work of international investigators in the field.
Rapid thermal processing has contributed to the development of single wafer cluster processing tools and other innovations in integrated circuit manufacturing environments. Borisenko and Hesketh review theoretical and experimental progress in the field, discussing a wide range of materials, processes, and conditions. They thoroughly cover the work of international investigators in the field.
Product Details
Format
Paperback
Publication date
2013
Publisher
Springer-Verlag New York Inc. United States
Number of pages
358
Condition
New
Series
Microdevices
Number of Pages
358
Place of Publication
New York, United States
ISBN
9781489918062
SKU
V9781489918062
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
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