Semiconductor Device Analysis Using Photon Emisson Microscopy
Wai Kin Chim
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Description for Semiconductor Device Analysis Using Photon Emisson Microscopy
Hardcover. Fault detection has become increasingly difficult as integrated circuits become more and more complex. Photon Emission Microscopy (PEM) is a physical failure analysis technique which locates and identifies faults in integrated circuits. Num Pages: 288 pages, Illustrations. BIC Classification: TJFD5. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 232 x 160 x 20. Weight in Grams: 534.
The diminishing size and greater complexity of modern semiconductor integrated circuits poses new challenges in fault detection. Photon Emission Microscopy (PEM) is a physical fault localisation technique used for analysing IC failures. Detailing the PEM technique and its application to semiconductor device analysis, this unique reference:
* Illustrates the application of the PEM technique in various areas of device reliability, in particular hot-carrier, oxide and ESD reliability.
* Presents the principles of design and calibration for a spectroscopic emission microscope system along with coverage of the three main operation modes: frontside, backside and spectroscopic PEM
* Provides ... Read more
The diminishing size and greater complexity of modern semiconductor integrated circuits poses new challenges in fault detection. Photon Emission Microscopy (PEM) is a physical fault localisation technique used for analysing IC failures. Detailing the PEM technique and its application to semiconductor device analysis, this unique reference:
* Illustrates the application of the PEM technique in various areas of device reliability, in particular hot-carrier, oxide and ESD reliability.
* Presents the principles of design and calibration for a spectroscopic emission microscope system along with coverage of the three main operation modes: frontside, backside and spectroscopic PEM
* Provides ... Read more
Product Details
Format
Hardback
Publication date
2000
Publisher
John Wiley and Sons Ltd United Kingdom
Number of pages
288
Condition
New
Number of Pages
288
Place of Publication
New York, United States
ISBN
9780471492405
SKU
V9780471492405
Shipping Time
Usually ships in 7 to 11 working days
Ref
99-50
About Wai Kin Chim
Wai Kin Chim is the author of Semiconductor Device and Failure Analysis : Using Photon Emission Microscopy , published by Wiley.
Reviews for Semiconductor Device Analysis Using Photon Emisson Microscopy
"This reference details the principles of design, calibration, and use of photon emission microscopy (PEM) as a fault localization technique used for analyzing device reliability and failure." (SciTech Book News Vol. 25, No. 2 June 2001)