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Design and Analysis of Heat Sinks
Allan D. Kraus
€ 203.08
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Description for Design and Analysis of Heat Sinks
Hardcover. This book presents new design techniques that permit an engineer to design devices with predictable results, and in doing so utilize very complex shapes instead of being limited to simple shapes. Includes coverage of the material properties of the devices. Series: Thermal Management of Microelectronic and Electronic System Series. Num Pages: 424 pages, Illustrations. BIC Classification: TBC; TGMB; TJFD. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 239 x 161 x 32. Weight in Grams: 804.
A powerful methodology for producing superior thermal performanceat low cost with minimum added mass . . .
Here is the only available comprehensive treatment of the designand analysis of heat sinks. It provides all the theoretical andpractical information necessary to successfully design and/orselect cost-effective heat sinks for electronic equipment. Thepresentation includes detailed explanations of the governing heattransfer phenomena, complete coverage of thermal modeling tools forgeometrically complex fin structures, and extensive discussion onrecognizing thermal optimization opportunities.
Other topics covered include:
* Fundamentals of heat transfer
* Thermal modeling of electronic packages
* ... Read more
A powerful methodology for producing superior thermal performanceat low cost with minimum added mass . . .
Here is the only available comprehensive treatment of the designand analysis of heat sinks. It provides all the theoretical andpractical information necessary to successfully design and/orselect cost-effective heat sinks for electronic equipment. Thepresentation includes detailed explanations of the governing heattransfer phenomena, complete coverage of thermal modeling tools forgeometrically complex fin structures, and extensive discussion onrecognizing thermal optimization opportunities.
Other topics covered include:
* Fundamentals of heat transfer
* Thermal modeling of electronic packages
* ... Read more
Product Details
Format
Hardback
Publication date
1995
Publisher
John Wiley and Sons Ltd United States
Number of pages
424
Condition
New
Series
Thermal Management of Microelectronic and Electronic System Series
Number of Pages
424
Place of Publication
, United States
ISBN
9780471017554
SKU
V9780471017554
Shipping Time
Usually ships in 7 to 11 working days
Ref
99-50
About Allan D. Kraus
ALLAN D. KRAUS is Principal Associate of Allan D. Kraus Associates,a consulting firm in Pacific Grove, California. He is a formerfaculty member in the Electrical Engineering Department of theNaval Postgraduate School in Monterey, California. AVRAM BAR-COHEN is Professor and Director of the Thermodynamics andHeat Transfer Division in the Mechanical Engineering Department ofthe University of Minnesota.
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