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Moisture Sensitivity of Plastic Packages of IC Devices
. Ed(S): Fan, X. J.; Suhir, Ephraim
€ 318.51
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Description for Moisture Sensitivity of Plastic Packages of IC Devices
Paperback. This book provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. It includes numerous industrial applications, along with the results of the most recent research and development efforts. Editor(s): Fan, X. J.; Suhir, Ephraim. Series: Micro and Opto-Electronic Materials, Structures, and Systems. Num Pages: 558 pages, biography. BIC Classification: TBC; TJF; TJFD. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 30. Weight in Grams: 816.
Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field. ... Read more
Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field. ... Read more
Product Details
Format
Paperback
Publication date
2012
Publisher
Springer-Verlag New York Inc. United States
Number of pages
558
Condition
New
Series
Micro and Opto-Electronic Materials, Structures, and Systems
Number of Pages
558
Place of Publication
New York, NY, United States
ISBN
9781461426257
SKU
V9781461426257
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
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