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The Piezojunction Effect In Silicon Inte
Fruett, Fabiano; Meijer, Gerard C. M.
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Description for The Piezojunction Effect In Silicon Inte
Hardback. Describes techniques that can reduce mechanical-stress-induced inaccuracy and long-term instability in chips. This book shows that the piezojunction effect can be applied for fresh types of mechanical-sensor structures. Series: The Springer International Series in Engineering and Computer Science. Num Pages: 162 pages, biography. BIC Classification: TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 235 x 155 x 11. Weight in Grams: 426.
Mechanical stress affects the magnitude of base-emitter voltages of forward biased bipolar transistors. This phenomenon is called the piezojunction effect. The piezojunction effect is the main cause of inaccuracy and drift in integrated temperature sensors and bandgap voltage references. The aim of The Piezojunction Effect in Silicon Integrated Circuits and Sensors is twofold. Firstly, to describe techniques that can reduce the mechanical-stress-induced inaccuracy and long-term instability. Secondly, to show, that the piezojunction effect can be applied for new types of mechanical-sensor structures. During IC fabrication and packaging thermo-mechanical stress is ... Read more
Mechanical stress affects the magnitude of base-emitter voltages of forward biased bipolar transistors. This phenomenon is called the piezojunction effect. The piezojunction effect is the main cause of inaccuracy and drift in integrated temperature sensors and bandgap voltage references. The aim of The Piezojunction Effect in Silicon Integrated Circuits and Sensors is twofold. Firstly, to describe techniques that can reduce the mechanical-stress-induced inaccuracy and long-term instability. Secondly, to show, that the piezojunction effect can be applied for new types of mechanical-sensor structures. During IC fabrication and packaging thermo-mechanical stress is ... Read more
Product Details
Format
Hardback
Publication date
2002
Publisher
Kluwer Academic Publishers United States
Number of pages
162
Condition
New
Series
The Springer International Series in Engineering and Computer Science
Number of Pages
162
Place of Publication
New York, NY, United States
ISBN
9781402070532
SKU
V9781402070532
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
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