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Gerard Kelly - The Simulation Of Thermomechanically Ind - 9780792384854 - V9780792384854
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The Simulation Of Thermomechanically Ind

€ 121.95
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Description for The Simulation Of Thermomechanically Ind Hardback. Deals with understanding the complex stress distributions, transfer mechanisms, warpage, and potential failures arising from the encapsulation of devices in plastic. This book emphasises on the correct use of finite element tools for these problems. Num Pages: 153 pages, biography. BIC Classification: TD; TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 244 x 170 x 11. Weight in Grams: 410.
One of the greatest challenges facing package manufacturers is to develop reliable fine pitch thin packages with high leadcounts, capable of dissipating heat, and deliver them in volume to the market in a very short space of time. How can this be done? Firstly, package structures, materials, and manufacturing processes must be optimised. Secondly, it is necessary to predict the likely failures and behaviour of parts before manufacture, whilst minimising the amount of time and money invested in undertaking costly experimental trials. In a high volume production environment, any design improvement that increases yield and reliability can be of immense ... Read more

Product Details

Format
Hardback
Publication date
1999
Publisher
Kluwer Academic Publishers United States
Number of pages
153
Condition
New
Number of Pages
134
Place of Publication
Dordrecht, Netherlands
ISBN
9780792384854
SKU
V9780792384854
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15

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