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Thermal Stress and Strain in Microelectronics Packaging
John . Ed(S): Lau
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Description for Thermal Stress and Strain in Microelectronics Packaging
Paperback. Editor(s): Lau, John. Num Pages: 908 pages, 466 black & white illustrations, biography. BIC Classification: TDP; TJF. Category: (P) Professional & Vocational. Dimension: 229 x 152 x 45. Weight in Grams: 1305.
Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications. In order to have a high density/ performance/yield/quality/reliability, low cost, and light weight system, a more precise understanding of the system behavior is required. Mechanical and thermal phenomena are among the least understood and most complex of the many phenomena encountered in microelectronics packaging systems and are found on the critical path of neatly every design and process in the electronics industry. The last decade has witnessed an explosive growth in the research and development efforts devoted ... Read more
Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications. In order to have a high density/ performance/yield/quality/reliability, low cost, and light weight system, a more precise understanding of the system behavior is required. Mechanical and thermal phenomena are among the least understood and most complex of the many phenomena encountered in microelectronics packaging systems and are found on the critical path of neatly every design and process in the electronics industry. The last decade has witnessed an explosive growth in the research and development efforts devoted ... Read more
Product Details
Format
Paperback
Publication date
2012
Publisher
Springer-Verlag New York Inc. United States
Number of pages
908
Condition
New
Number of Pages
884
Place of Publication
New York, NY, United States
ISBN
9781468477696
SKU
V9781468477696
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
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