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25%OFFAlfred R. Webb (Ed.) - Thermal Stresses: Design, Behavior & Applications - 9781634853736 - V9781634853736
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Thermal Stresses: Design, Behavior & Applications

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Description for Thermal Stresses: Design, Behavior & Applications Hardback. Editor(s): Webb, Alfred R. Num Pages: 230 pages. BIC Classification: PHH; TGM. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 160 x 231 x 19. Weight in Grams: 460.
Thermal stresses which originate as a consequence of different thermal expansion coefficients of components of multi-component materials represent an important phenomenon in multi-component materials. These stresses are usually investigated by computational and experimental methods are still of interest to materials scientists and engineers. In this book, the design, behavior and applications of thermal stresses are discussed. Chapter One introduces a full three-dimensional, non-isothermal computational fluid dynamics (CFD) model of an operating PEM fuel cell which was developed to simulate the thermal stresses inside the cell. Chapter Two deals with mutual comparison of different analytical models of thermal stresses in a ... Read more

Product Details

Format
Hardback
Publication date
2016
Publisher
Nova Science Publishers Inc
Condition
New
Number of Pages
230
Place of Publication
New York, United States
ISBN
9781634853736
SKU
V9781634853736
Shipping Time
Usually ships in 5 to 9 working days
Ref
99-2

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