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Three Dimensional System Integration
. Ed(S): Papanikolaou, Antonis; Soudris, Dimitrios (Department Of Electrical And Computer Engineering, Democritus University Of Thrace, Xanthi, Greec
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Description for Three Dimensional System Integration
Hardback. Editor(s): Papanikolaou, Antonis; Soudris, Dimitrios (Department of Electrical and Computer Engineering, Democritus University of Thrace, Xanthi, Greece); Radojcic, Riko. Num Pages: 254 pages, biography. BIC Classification: TBD; TJFC. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 15. Weight in Grams: 537.
Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing ... Read more
Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing ... Read more
Product Details
Format
Hardback
Publication date
2010
Publisher
Springer-Verlag New York Inc. United States
Number of pages
254
Condition
New
Number of Pages
246
Place of Publication
New York, NY, United States
ISBN
9781441909619
SKU
V9781441909619
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
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