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Ultra-low Power Wireless Technologies for Sensor Networks
Otis, Brian; Rabaey, Jan M.
€ 131.54
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Description for Ultra-low Power Wireless Technologies for Sensor Networks
Hardback. This book is written for academic and professional researchers designing communication systems for pervasive and low power applications. The main emphasis is on design techniques for low power, highly integrated transceivers. Series: Integrated Circuits and Systems. Num Pages: 184 pages, biography. BIC Classification: TJKW. Category: (UU) Undergraduate. Dimension: 234 x 156 x 12. Weight in Grams: 1030.
transconductance e?ciency of all critical devices in order to reduce the n- essary bias current. However, reducing the current density also results in a severely decreased device f . An optimization of the current density is re- T quired to provide the correct balance between transconductance e?ciency and bandwidth. Plots such as Figure 2. 1 are useful tools for designers when choosing appropriate transistor bias points. Technology scaling allows greatly increased f realization for a given IC. Thus, weak inversion biasing for RF T design will become increasingly useful in future technology nodes. Throughout this work, the IC of critical ... Read more
transconductance e?ciency of all critical devices in order to reduce the n- essary bias current. However, reducing the current density also results in a severely decreased device f . An optimization of the current density is re- T quired to provide the correct balance between transconductance e?ciency and bandwidth. Plots such as Figure 2. 1 are useful tools for designers when choosing appropriate transistor bias points. Technology scaling allows greatly increased f realization for a given IC. Thus, weak inversion biasing for RF T design will become increasingly useful in future technology nodes. Throughout this work, the IC of critical ... Read more
Product Details
Format
Hardback
Publication date
2007
Publisher
Springer-Verlag New York Inc. United States
Number of pages
184
Condition
New
Series
Integrated Circuits and Systems
Number of Pages
184
Place of Publication
New York, NY, United States
ISBN
9780387309309
SKU
V9780387309309
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
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