Ultra-thin Chip Technology and Applications
Joachim N. . Ed(S): Burghartz
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Description for Ultra-thin Chip Technology and Applications
Hardback. This book shows how very thin and flexible chips can be fabricated and used in many new applications. It provides a comprehensive overview of the challenges in ultra-thin chip fabrication, post processing, properties and applications. Editor(s): Burghartz, Joachim N. Num Pages: 467 pages, biography. BIC Classification: TJFC; UGC. Category: (P) Professional & Vocational. Dimension: 242 x 163 x 25. Weight in Grams: 806.
Ultra-thin chips are the "smart skin" of a conventional silicon chip. This book shows how very thin and flexible chips can be fabricated and used in many new applications in microelectronics, Microsystems, biomedical and other fields. It provides a comprehensive reference to the fabrication technology, post processing, characterization and the applications of ultra-thin chips.
Ultra-thin chips are the "smart skin" of a conventional silicon chip. This book shows how very thin and flexible chips can be fabricated and used in many new applications in microelectronics, Microsystems, biomedical and other fields. It provides a comprehensive reference to the fabrication technology, post processing, characterization and the applications of ultra-thin chips.
Product Details
Format
Hardback
Publication date
2010
Publisher
Springer-Verlag New York Inc. United States
Number of pages
467
Condition
New
Number of Pages
467
Place of Publication
New York, NY, United States
ISBN
9781441972750
SKU
V9781441972750
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
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