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VLSI-SoC - from Systems to Silicon
. Ed(S): Reis, Ricardo; Osseiran, Adam; Pfleiderer, Hans-Joerg
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Description for VLSI-SoC - from Systems to Silicon
Hardback. Contains extended and revised versions of the papers that were presented during the thirteenth edition of the IFIP TC 10 International Conference on Very Large Scale Integration, a Global System-on-Chip Design and CAD conference. Editor(s): Reis, Ricardo; Osseiran, Adam; Pfleiderer, Hans-Joerg. Series: IFIP Advances in Information and Communication Technology. Num Pages: 354 pages, 176 black & white illustrations, 55 black & white tables, biography. BIC Classification: TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 234 x 156 x 20. Weight in Grams: 691.
This book contains extended and revised versions of the best papers that were presented during the thirteenth edition of the IFIP TC10/WG10.5 International Conference on Very Large Scale Integration, a Global System-on-a-Chip Design & CAD conference. The 13th conference was held at the Parmelia Hilton Hotel, Perth, Western Australia (October 17-19, 2005). Previous conferences have taken place in Edinburgh, Trondheim, Vancouver, Munich, Grenoble, Tokyo, Gramado, Lisbon, Montpellier and Darmstadt. The purpose of this conference, sponsored by IFIP TC 10 Working Group 10.5, is to provide a forum to exchange ideas and show industrial and academic research results in the field ... Read more
This book contains extended and revised versions of the best papers that were presented during the thirteenth edition of the IFIP TC10/WG10.5 International Conference on Very Large Scale Integration, a Global System-on-a-Chip Design & CAD conference. The 13th conference was held at the Parmelia Hilton Hotel, Perth, Western Australia (October 17-19, 2005). Previous conferences have taken place in Edinburgh, Trondheim, Vancouver, Munich, Grenoble, Tokyo, Gramado, Lisbon, Montpellier and Darmstadt. The purpose of this conference, sponsored by IFIP TC 10 Working Group 10.5, is to provide a forum to exchange ideas and show industrial and academic research results in the field ... Read more
Product Details
Format
Hardback
Publication date
2007
Publisher
Springer-Verlag New York Inc. United States
Number of pages
354
Condition
New
Series
IFIP Advances in Information and Communication Technology
Number of Pages
344
Place of Publication
New York, NY, United States
ISBN
9780387736600
SKU
V9780387736600
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
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