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Wafer Scale Integration
Earl E. . Ed(S): Swartzlander
€ 251.61
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Description for Wafer Scale Integration
Paperback. Editor(s): Swartzlander, Earl E. Num Pages: 503 pages, black & white illustrations, bibliography. BIC Classification: THR; TJFC; UYF. Category: (G) General (US: Trade). Dimension: 235 x 155 x 27. Weight in Grams: 801.
Wafer Scale Integration (WSI) is the culmination of the quest for larger integrated circuits. In VLSI chips are developed by fabricating a wafer with hundreds of identical circuits, testing the circuits, dicing the wafer, and packaging the good dice. In contrast in WSI, a wafer is fabricated with several types of circuits (generally referred to as cells), with multiple instances of each cell type, the cells are tested, and good cells are interconnected to realize a system on the wafer. Since most signal lines stay on the wafer, stray capacitance is low, so that high speeds are achieved with low ... Read more
Wafer Scale Integration (WSI) is the culmination of the quest for larger integrated circuits. In VLSI chips are developed by fabricating a wafer with hundreds of identical circuits, testing the circuits, dicing the wafer, and packaging the good dice. In contrast in WSI, a wafer is fabricated with several types of circuits (generally referred to as cells), with multiple instances of each cell type, the cells are tested, and good cells are interconnected to realize a system on the wafer. Since most signal lines stay on the wafer, stray capacitance is low, so that high speeds are achieved with low ... Read more
Product Details
Format
Paperback
Publication date
2012
Publisher
Springer-Verlag New York Inc. United States
Number of pages
503
Condition
New
Number of Pages
503
Place of Publication
New York, NY, United States
ISBN
9781461288961
SKU
V9781461288961
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
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