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Electronics & communications engineering

Results 2201 - 2220 of 10877

Electronics & communications engineering

paperback. Editor(s): Efros, Alexander L. (Naval Research Laboratory, Washington, DC, USA); Lockwood, D. J.; Tsybeskov, Leonid. Series: Nanostructure Science and Technology. Num Pages: 277 pages, biography. BIC Classification: PHFC; PNFS; TGMT; TJFD. Category: (P) Professional & Vocational. Dimension: 254 x 178 x 14. Weight in Grams: 397.
Format
Paperback
Publication date
2010
Publisher
Springer United States
Edition
2003rd Edition
Number of pages
277
Condition
New
SKU
V9781441934024
ISBN
9781441934024
Paperback
Condition: New

€ 196.87

Paperback. Series: Structure and Bonding. Num Pages: 202 pages, biography. BIC Classification: PNK; PNRH; PNT; TBN; TGMT; TJFD. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 10. Weight in Grams: 320.
Format
Paperback
Publication date
2010
Publisher
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Germany
Edition
Softcover reprint of hardcover 1st ed. 2005
Number of pages
202
Condition
New
SKU
V9783642066184
ISBN
9783642066184
Paperback
Condition: New

€ 249.30

Hardback. Editor(s): Peng, Xiaogang; Mingos, David Michael P. (University of Oxford). Series: Structure and Bonding. Num Pages: 202 pages, biography. BIC Classification: TJFD5. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 12. Weight in Grams: 465.
Format
Hardback
Publication date
2005
Publisher
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Germany
Number of pages
202
Condition
New
SKU
V9783540278054
ISBN
9783540278054
Hardback
Condition: New

€ 249.81

paperback. Num Pages: 786 pages, biography. BIC Classification: TBJ; THR; TJF; TJFC; TJFN; UGC. Category: (G) General (US: Trade). Dimension: 235 x 155 x 40. Weight in Grams: 1193.
Format
Paperback
Publication date
2014
Publisher
Springer United States
Edition
2006th Edition
Number of pages
786
Condition
New
SKU
V9781489991379
ISBN
9781489991379
Paperback
Condition: New

€ 199.03

Paperback. This book describes the key theoretical techniques needed to quantitatively calculate and simulate the properties of semiconductor materials. Covers such techniques as 2D heterostructures, quantum wires, quantum dots and nitrogen containing III-V alloys. Editor(s): Marie, Xavier; Balkan, Naci. Series: Springer Series in Materials Science. Num Pages: 276 pages, biography. BIC Classification: PHV; TBN; TJFC; TJFD5. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 15. Weight in Grams: 427.
Format
Paperback
Publication date
2014
Publisher
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Germany
Number of pages
276
Condition
New
SKU
V9783642434679
ISBN
9783642434679
Paperback
Condition: New

€ 127.54

Hardback. This book describes the key theoretical techniques needed to quantitatively calculate and simulate the properties of semiconductor materials. Covers such techniques as 2D heterostructures, quantum wires, quantum dots and nitrogen containing III-V alloys. Editor(s): Balkan, Naci; Xavier, Marie. Series: Springer Series in Materials Science. Num Pages: 276 pages, biography. BIC Classification: PHV; TBN; TJFC; TJFD5. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 20. Weight in Grams: 578.
Format
Hardback
Publication date
2012
Publisher
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Germany
Edition
2012
Number of pages
276
Condition
New
SKU
V9783642275111
ISBN
9783642275111
Hardback
Condition: New

€ 128.63

Hardback. Assists engineers in designing high-speed circuits. The emphasis is on semiconductor modeling, with PCB transmission line effects, equipment enclosure effects, and other modeling issues discussed as needed. This text addresses practical considerations, including process variation, model accuracy, validation and verification, and signal integrity. Num Pages: 766 pages, biography. BIC Classification: TJFC; TJFN; UGC. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 41. Weight in Grams: 2810.
Format
Hardback
Publication date
2006
Publisher
Springer-Verlag New York Inc. United States
Number of pages
766
Condition
New
SKU
V9780387241593
ISBN
9780387241593
Hardback
Condition: New

€ 208.09

Hardcover. Provides the reader with memory fundamentals as well as directions for future research. Examines memory history, current memory technology and offers a glimpse at the future of memories. Num Pages: 822 pages, index. BIC Classification: PHFC; TJFC; UKS. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 257 x 198 x 50. Weight in Grams: 1800.
Format
Hardback
Publication date
1996
Publisher
John Wiley and Sons Ltd United Kingdom
Edition
2nd Edition
Number of pages
822
Condition
New
SKU
V9780471942955
ISBN
9780471942955
Hardback
Condition: New

€ 772.69

Hardback. Editor(s): Paranthaman, M. Parans; Bhattacharya, Raghu N.; Wong-Ng, Winnie K. Series: Springer Series in Materials Science. Num Pages: 293 pages, 15 black & white tables, biography. BIC Classification: PHFC; TGM; THX; TJFD5. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 18. Weight in Grams: 607.
Format
Hardback
Publication date
2015
Publisher
Springer International Publishing AG Switzerland
Number of pages
293
Condition
New
SKU
V9783319203300
ISBN
9783319203300
Hardback
Condition: New

€ 128.63

Paperback. Series: Microdevices. Num Pages: 228 pages, 37 black & white illustrations, biography. BIC Classification: TJFD5. Category: (P) Professional & Vocational. Dimension: 244 x 170 x 13. Weight in Grams: 421.
Format
Paperback
Publication date
2013
Publisher
Springer-Verlag New York Inc. United States
Edition
Softcover reprint of the original 1st ed. 2003
Number of pages
228
Condition
New
SKU
V9781475777932
ISBN
9781475777932
Paperback
Condition: New

€ 127.57

Hardcover. This Third Edition updates a landmark text with the latest findings The Third Edition of the internationally lauded Semiconductor Material and Device Characterization brings the text fully up-to-date with the latest developments in the field and includes new pedagogical tools to assist readers. Num Pages: 800 pages, illustrations. BIC Classification: TJFD5. Category: (P) Professional & Vocational. Dimension: 238 x 164 x 42. Weight in Grams: 1199.
Format
Hardback
Publication date
2006
Publisher
John Wiley and Sons Ltd United Kingdom
Edition
3rd Edition
Number of pages
800
Condition
New
SKU
V9780471739067
ISBN
9780471739067
Hardback
Condition: New

€ 233.71

Paperback. Series: Microdevices. Num Pages: 952 pages, biography. BIC Classification: TJFD5. Category: (P) Professional & Vocational. Dimension: 244 x 170 x 48. Weight in Grams: 1604.
Format
Paperback
Publication date
2012
Publisher
Springer-Verlag New York Inc. United States
Edition
Softcover reprint of the original 1st ed. 1988
Number of pages
952
Condition
New
SKU
V9781461282280
ISBN
9781461282280
Paperback
Condition: New

€ 201.68

hardcover. The extended 3rd edition of this book covers such innovations as chaos synchronization between two lasers used for optical secure communication, fast physical number generation using chaotic semiconductor lasers and development and application of chaos chips. Series: Springer Series in Optical Sciences. Num Pages: 667 pages, 234 black & white illustrations, 97 colour illustrations, 30 colour tables, biography. BIC Classification: PHFP; TJFD5; TJFN; TTBL. Category: (P) Professional & Vocational. Dimension: 235 x 155. .
Format
Hardback
Publication date
2017
Publisher
Springer Switzerland
Edition
4th ed. 2017
Number of pages
667
Condition
New
SKU
V9783319561370
ISBN
9783319561370
Hardback
Condition: New

€ 320.16

Paperback. The extended 3rd edition of this book covers such innovations as chaos synchronization between two lasers used for optical secure communication, fast physical number generation using chaotic semiconductor lasers and development and application of chaos chips. Series: Springer Series in Optical Sciences. Num Pages: 592 pages, biography. BIC Classification: PHFP; PHJ; TJFD5; TJFN; TTB. Category: (G) General (US: Trade). Dimension: 235 x 155 x 30. Weight in Grams: 896.
Format
Paperback
Publication date
2014
Publisher
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Germany
Edition
3 Rev ed
Number of pages
592
Condition
New
SKU
V9783642433412
ISBN
9783642433412
Paperback
Condition: New

€ 229.61

Hardcover. This reference book provides a fully integrated novel approach to the development of high-power, single-transverse mode, edge-emitting diode lasers by addressing the complementary topics of device engineering, reliability engineering and device diagnostics in the same book, and thus closes the gap in the current book literature. Num Pages: 522 pages, Illustrations. BIC Classification: TJFD5; TTBL. Category: (P) Professional & Vocational. Dimension: 236 x 161 x 30. Weight in Grams: 780.
Format
Hardback
Publication date
2013
Publisher
John Wiley & Sons Inc United States
Edition
1st Edition
Number of pages
522
Condition
New
SKU
V9781119990338
ISBN
9781119990338
Hardback
Condition: New

€ 124.51

Paperback. .
Publisher
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Germany
Number of pages
408
Format
Paperback
Publication date
2011
Edition
Softcover reprint of the original 1st ed. 1987
Condition
New
SKU
V9783642729690
ISBN
9783642729690
Paperback
Condition: New

€ 130.69
€ 20.68

paperback. Num Pages: 258 pages, biography. BIC Classification: PBK; PDE; PHU; TJF; UYQ. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 14. Weight in Grams: 415.
Format
Paperback
Publication date
2011
Publisher
Springer Verlag GmbH Austria
Edition
Softcover reprint of the original 1st ed. 1990
Number of pages
258
Condition
New
SKU
V9783709174524
ISBN
9783709174524
Paperback
Condition: New

€ 127.46

Hardcover. * Covers all key semiconductor devices with up-to-date information and easy-to-understand descriptions. Each chapter is presented in a logical manner enabling students to learn all important devices from a single source. * Covers historical developments of devices and technology in the last 100 years. Num Pages: 592 pages, black & white tables, figures. BIC Classification: TJ. Category: (P) Professional & Vocational. Dimension: 261 x 207 x 25. Weight in Grams: 1158.
Format
Hardback
Publication date
2016
Publisher
John Wiley & Sons Inc
Edition
3rd Edition
Condition
New
SKU
V9780470537947
ISBN
9780470537947
Hardback
Condition: New

€ 331.83

Hardback. This volume offers a new approach to teaching the fundamentals of semiconductor components based on the use of the accompanying process and device simulation software. Users are encouraged to augment their understanding by undertaking simulations and creating their own devices. Num Pages: 346 pages, Illustrations. BIC Classification: PHFC; TJFD5. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 250 x 174 x 25. Weight in Grams: 744.
Format
Hardback
Publication date
1999
Publisher
John Wiley & Sons Inc United Kingdom
Edition
1st Edition
Number of pages
346
Condition
New
SKU
V9780471988540
ISBN
9780471988540
Hardback
Condition: New

€ 166.19

Paperback. With contributions by numerous experts Editor(s): Kressel, H. Num Pages: 312 pages, biography. BIC Classification: TJF; TJFD; TJK. Category: (P) Professional & Scholarly; (U) Tertiary Education (US: College). Dimension: 235 x 155 x 18. Weight in Grams: 505.
Format
Paperback
Publication date
1986
Publisher
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Germany
Edition
2nd, updated ed. 1982. 2nd printing
Number of pages
312
Condition
New
SKU
V9783540113485
ISBN
9783540113485
Paperback
Condition: New

€ 67.27

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