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Electronics & communications engineering

Results 2861 - 2880 of 5951

Electronics & communications engineering

This book focuses on new techniques, analysis, applications and future trends of microstrip and printed antenna technologies, with particular emphasis to recent advances from the last decade Attention is given to fundamental concepts and techniques, their practical applications and the future scope of developments. Editor(s): Guha, Debatosh; Antar, Yahia M. M. Num Pages: 504 pages, Illustrations. BIC Classification: TJK. Category: (P) Professional & Vocational. Dimension: 246 x 174 x 31. Weight in Grams: 1014.
Publication date
2010
Publisher
John Wiley and Sons Ltd United States
Number of pages
504
Condition
New
SKU
V9780470681923
ISBN
9780470681923
Condition: New

€ 146.78

Hardcover. Focusing on microstereolithography and other microfabrication for 3D MEMS, this volume discusses the principles of microstereolithography for fabrication of 3D MEMS devices. It provides an account of the developments in related microfabrication and combined architecture techniques, illustrating their application in the engineering field. Num Pages: 274 pages, Ill. BIC Classification: TJFD. Category: (P) Professional & Vocational; (XV) Technical / Manuals. Dimension: 233 x 161 x 20. Weight in Grams: 526.
Format
Hardback
Publication date
2001
Publisher
John Wiley and Sons Ltd United Kingdom
Edition
1st Edition
Number of pages
274
Condition
New
SKU
V9780471521853
ISBN
9780471521853
Hardback
Condition: New

€ 269.25

Hardcover. From the electronic nose and the intelligent ear to the modern ink jet nozzle, the applications of smart devices incorporating microsensors are increasing rapidly. Microsensors are miniature devices that convert a non--electrical quantity into an electrical signal. By integrating a microsensor with a microprocessor, a smart sensor is produced. Num Pages: 522 pages, Illustrations. BIC Classification: TDPB; TJFC; TJFD. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 251 x 177 x 34. Weight in Grams: 1028.
Format
Hardback
Publication date
2001
Publisher
John Wiley and Sons Ltd United Kingdom
Edition
1st Edition
Number of pages
522
Condition
New
SKU
V9780471861096
ISBN
9780471861096
Hardback
Condition: New

€ 149.99

Hardback. Discusses experimental and theoretical studies of heat transfer in transistors and interconnects. This book reports techniques for determining the thermal transport properties of dielectric passivation layers and ultra-thin silicon-on-insulator (SOI) layers. Series: Microsystems. Num Pages: 123 pages, biography. BIC Classification: TJFD5. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 234 x 156 x 9. Weight in Grams: 810.
Format
Hardback
Publication date
1999
Publisher
Kluwer Academic Publishers United States
Number of pages
123
Condition
New
SKU
V9780792385912
ISBN
9780792385912
Hardback
Condition: New

€ 124.59

Hardback. Provides a presentation of the involvement of microprocessors in the design and operation of modern robotic and manufacturing systems. Prepared by a team of experts, this book is a reference source providing access to the advances in the microprocessor-based robotics and manufacturing field. Editor(s): Tzafestas, Spyros G. Series: Microprocessor-based & Intelligent Systems Engineering S. Num Pages: 426 pages, biography. BIC Classification: TJFM1. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 234 x 156 x 23. Weight in Grams: 779.
Format
Hardback
Publication date
1991
Publisher
Kluwer Academic Publishers United States
Number of pages
426
Condition
New
SKU
V9780792307808
ISBN
9780792307808
Hardback
Condition: New

€ 247.07

Paperback. .
Publisher
Springer Netherlands
Number of pages
426
Format
Paperback
Publication date
2012
Edition
Softcover reprint of the original 1st ed. 1991
Condition
New
SKU
V9789401056946
ISBN
9789401056946
Paperback
Condition: New

€ 212.96
€ 130.76

Hardcover. The market for single chip microprocessors is huge and their performance continues to increase, driven by the on-going demand for more powerful applications, particularly in the control and signal processing domains. Num Pages: 428 pages, Illustrations. BIC Classification: TJFD1; UYFP. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 255 x 183 x 30. Weight in Grams: 930.
Format
Hardback
Publication date
1997
Publisher
John Wiley and Sons Ltd United Kingdom
Edition
1st Edition
Number of pages
428
Condition
New
SKU
V9780471971573
ISBN
9780471971573
Hardback
Condition: New

€ 289.34

Hardback. Presents a packaged ultrasound microsystem for object detection and distance metering based on micromachined silicon transducer elements. This title describes the characterization, optimization and the long-term stability of silicon membrane resonators as well as appropriate packaging for ultrasound microsystems. Series: Microsystems. Num Pages: 121 pages, biography. BIC Classification: TDPB; TJFD. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 9. Weight in Grams: 830.
Format
Hardback
Publication date
1999
Publisher
Kluwer Academic Publishers United States
Number of pages
121
Condition
New
SKU
V9780792385080
ISBN
9780792385080
Hardback
Condition: New

€ 124.93

Paperback. Series: Microsystems. Num Pages: 121 pages, biography. BIC Classification: THR; TJFD. Category: (G) General (US: Trade). Dimension: 235 x 155 x 7. Weight in Grams: 225.
Format
Paperback
Publication date
2012
Publisher
Springer-Verlag New York Inc. United States
Edition
Softcover reprint of the original 1st ed. 1999
Number of pages
121
Condition
New
SKU
V9781461372691
ISBN
9781461372691
Paperback
Condition: New

€ 120.12

Paperback. Demonstrates the successful co-integration of gas-flow sensors on dielectric membrane, with their associated electronics, in CMOS-SOI technology. This title also focuses on sensors design and characteristics, in which a novel loop-shape polysilicon microheater is designed and built in a CMOS-SOI standard process. Num Pages: 306 pages, biography. BIC Classification: PHFC; PNFS; TBC; TJFC; TJFD5; TTB. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 16. Weight in Grams: 435.
Format
Paperback
Publication date
2010
Publisher
Springer-Verlag New York Inc. United States
Edition
1st ed. Softcover of orig. ed. 2006
Number of pages
306
Condition
New
SKU
V9781441939579
ISBN
9781441939579
Paperback
Condition: New

€ 184.99

Hardcover. Microgrids are the most innovative area in the electric power industry today. Future microgrids could exist as energy-balanced cells within existing power distribution grids or stand-alone power networks within small communities. Editor(s): Hatziargyriou, Nikos. Series: Wiley - IEEE. Num Pages: 340 pages, Illustrations. BIC Classification: THR; TJ. Category: (P) Professional & Vocational. Dimension: 250 x 176 x 22. Weight in Grams: 686.
Publisher
John Wiley & Sons Inc United States
Number of pages
344
Format
Hardback
Publication date
2014
Edition
1st Edition
Condition
New
SKU
V9781118720684
ISBN
9781118720684
Hardback
Condition: New

€ 104.35

Hardback. This book discusses relevant microgrid technologies in the context of integrating renewable energy and also addresses challenging issues. The authors summarize long term academic and research outcomes and contributions. Num Pages: 688 pages. BIC Classification: TJ. Category: (P) Professional & Vocational. Weight in Grams: 666.
Publisher
John Wiley and Sons Ltd
Format
Hardback
Publication date
2017
Edition
1st Edition
Condition
New
SKU
V9781119263678
ISBN
9781119263678
Hardback
Condition: New

€ 161.91

Hardback. Editor(s): Kuznetsov, Ivan A. Num Pages: 185 pages, illus, graphs. BIC Classification: PH; TJFM. Category: (P) Professional & Vocational. Dimension: 229 x 158 x 17. Weight in Grams: 400.
Format
Hardback
Publication date
2011
Publisher
Nova Science Publishers Inc United States
Edition
UK ed.
Number of pages
185
Condition
New
SKU
V9781616685706
ISBN
9781616685706
Hardback
Condition: New

€ 100.73
€ 70.11

Hardback. Fluidics originated as the description of pneumatic and hydraulic control systems, where fluids were employed (instead of electric currents) for signal transfer and processing. Num Pages: 456 pages, Illustrations. BIC Classification: TJFM. Category: (P) Professional & Vocational. Dimension: 235 x 196 x 29. Weight in Grams: 910.
Format
Hardback
Publication date
2014
Publisher
John Wiley & Sons Inc United Kingdom
Number of pages
456
Condition
New
SKU
V9780470619032
ISBN
9780470619032
Hardback
Condition: New

€ 164.12

Hardback. The contributors to this volume discuss the connections between microfluidics, microfabrication and the life sciences. In particular, they analyze the fundamental aspects of fluid mechanics in micro-scale and nano-scale confinements and microfabrication. Editor(s): Chakraborty, Suman. Num Pages: 357 pages, biography. BIC Classification: MQW; PHDF; TDPB; TJF. Category: (P) Professional & Vocational. Dimension: 245 x 167 x 23. Weight in Grams: 702.
Format
Hardback
Publication date
2009
Publisher
Springer-Verlag New York Inc. United States
Number of pages
357
Condition
New
SKU
V9781441915429
ISBN
9781441915429
Hardback
Condition: New

€ 192.73

Hardcover. Editor(s): Panzarella, Stefano; Maroni, Walter. Num Pages: 194 pages, Illustrations. BIC Classification: TJFM. Category: (P) Professional & Vocational. Dimension: 257 x 184 x 16. Weight in Grams: 536.
Format
Hardback
Publication date
2013
Publisher
Nova Science Publishers Inc United States
Number of pages
194
Condition
New
SKU
V9781624173455
ISBN
9781624173455
Hardback
Condition: New

€ 219.26
€ 148.88

Hardcover. Provides microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Offering a balance of theory and practical applications, this three volume set features step-by-step examples and technical data, simplifying each phase of package design and production. Num Pages: 720 pages, biography. BIC Classification: TJFD5; UM. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 234 x 156 x 39. Weight in Grams: 1386.
Publisher
Springer
Format
Hardback
Publication date
1997
Edition
2nd
Condition
New
SKU
V9780412084317
ISBN
9780412084317
Hardback
Condition: New

€ 244.98

Hardcover. Provides the advances in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. This book discusses packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Num Pages: 1030 pages, biography. BIC Classification: TJFD5; UM. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 234 x 156 x 55. Weight in Grams: 1742.
Publisher
Springer
Format
Hardback
Publication date
1997
Edition
2nd
Condition
New
SKU
V9780412084416
ISBN
9780412084416
Hardback
Condition: New

€ 414.83

Hardback. Provides information on microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. This three volume set discusses packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Num Pages: 628 pages, biography. BIC Classification: GBC; TJF. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 234 x 156 x 36. Weight in Grams: 1100.
Format
Hardback
Publication date
1997
Publisher
Chapman and Hall United Kingdom
Edition
2nd ed. 1997
Number of pages
628
Condition
New
SKU
V9780412084515
ISBN
9780412084515
Hardback
Condition: New

€ 189.19

Paperback. Num Pages: 720 pages, biography. BIC Classification: THR; TJF; UYF. Category: (G) General (US: Trade). Dimension: 235 x 155 x 38. Weight in Grams: 1133.
Format
Paperback
Publication date
1997
Publisher
Springer-Verlag New York Inc. United States
Edition
Softcover reprint of the original 2nd ed. 1997
Number of pages
720
Condition
New
SKU
V9781461368298
ISBN
9781461368298
Paperback
Condition: New

€ 241.37

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