Electronics engineering
Results 7881 - 7900 of 8451
Electronics engineering
hardcover. This in-depth view of varied aspects of power electronic packaging systematically introduces design, assembly, reliability and failure analysis and materials selection, as well as covering the most advanced simulation and modeling techniques in the field. Num Pages: 594 pages, 80 black & white tables, biography. BIC Classification: TJF. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 33. Weight in Grams: 1076.
- Format
- Hardback
- Publication date
- 2012
- Publisher
- Springer United States
- Edition
- 2012th Edition
- Number of pages
- 594
- Condition
- New
- SKU
- V9781461410522
- ISBN
- 9781461410522
Hardback
Condition: New
€ 299.12
€ 299.12
Materials and Reliability Handbook for Semiconductor Optical and Elect...
. Ed(S): Ueda, Osamu; Pearton, Steve
Hardback. This book covers reliability procedures for lasers and high speed electronics used in cell phones, satellites, data transmission systems and displays. Addresses reliability engineering, materials, reliability testing and electronic characterization. Editor(s): Ueda, Osamu; Pearton, Steve. Num Pages: 632 pages, 30 black & white tables, biography. BIC Classification: TGMT; TJFC; TJFD; TTBL. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 41. Weight in Grams: 1106.
- Format
- Hardback
- Publication date
- 2012
- Publisher
- Springer-Verlag New York Inc. United States
- Number of pages
- 632
- Condition
- New
- SKU
- V9781461443360
- ISBN
- 9781461443360
Hardback
Condition: New
€ 349.19
€ 349.19
Hardback. This book describes a new design approach for energy-efficient, Domain-Specific Instruction set Processor (DSIP) architectures used in the wireless baseband domain. Shows how to reduce development costs and increase scalability. Includes case studies. Editor(s): Catthoor, Francky. Num Pages: 289 pages, 12 black & white tables, biography. BIC Classification: TJFC; TJK; UYF. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 19. Weight in Grams: 631.
- Format
- Hardback
- Publication date
- 2013
- Publisher
- Springer-Verlag New York Inc. United States
- Number of pages
- 289
- Condition
- New
- SKU
- V9781461449911
- ISBN
- 9781461449911
Hardback
Condition: New
€ 182.02
€ 182.02
Hardback. Routing Algorithms in Networks-on-Chip Editor(s): Palesi, Maurizio; Daneshtalab, Masoud. Num Pages: 424 pages, 122 black & white illustrations, 97 colour illustrations, 40 black & white tables, biogra. BIC Classification: TJFC; UYF. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 24. Weight in Grams: 848.
- Format
- Hardback
- Publication date
- 2013
- Publisher
- Springer-Verlag New York Inc. United States
- Number of pages
- 424
- Condition
- New
- SKU
- V9781461482734
- ISBN
- 9781461482734
Hardback
Condition: New
€ 183.00
€ 183.00
Hardcover. Smart Mobile In-Vehicle Systems Editor(s): Schmidt, Gerhard; Abut, Huseyin (San Diego State University, San Diego, California); Takeda, Kazuya (University of Nagoya, Japan); Hansen, John H.L. (University of Colorado at Boulder). Num Pages: 292 pages, 86 black & white illustrations, 79 colour illustrations, 25 black & white tables, 1 colou. BIC Classification: TJFM; TJK; TRC; UYZG. Category: (P) Professional & Vocational. Dimension: 239 x 163 x 18. Weight in Grams: 578.
- Format
- Hardback
- Publication date
- 2013
- Publisher
- Springer
- Edition
- 2014th Edition
- Condition
- New
- SKU
- V9781461491194
- ISBN
- 9781461491194
Hardback
Condition: New
€ 182.29
€ 182.29
paperback. This book covers both control theory and wireless sensors, and shows how to utilize wireless network princples to achieve a distributed control. Includes contributions by leading researchers from communications and controls. Editor(s): Mazumder, Sudip K. Num Pages: 356 pages, biography. BIC Classification: TJFM; TJK; UKN. Category: (G) General (US: Trade). Dimension: 235 x 155 x 19. Weight in Grams: 545.
- Format
- Paperback
- Publication date
- 2014
- Publisher
- Springer United States
- Edition
- 2011th Edition
- Number of pages
- 356
- Condition
- New
- SKU
- V9781489981585
- ISBN
- 9781489981585
Paperback
Condition: New
€ 181.60
€ 181.60
Paperback. This book covers advances in logic synthesis and design, including Boolean Matching, Logic Decomposition, Boolean satisfiability, Advanced Synthesis Techniques and Applications of Logic Design. Also covers techniques for optimizing VLSI integrated circuits. Editor(s): Gulati, Kanupriya. Num Pages: 444 pages, biography. BIC Classification: TJFC; UGC. Category: (G) General (US: Trade). Dimension: 235 x 155 x 23. Weight in Grams: 682.
- Format
- Paperback
- Publication date
- 2014
- Publisher
- Springer-Verlag New York Inc. United States
- Number of pages
- 444
- Condition
- New
- SKU
- V9781489981882
- ISBN
- 9781489981882
Paperback
Condition: New
€ 161.84
€ 161.84
Reliability of Microtechnology: Interconnects, Devices and Systems
Liu, Johan; Salmela, Olli; Sarkka, Jussi; Mor...
paperback. This text discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. It covers many topics, and it addresses specific failure modes in solder and conductive adhesives at great length. Num Pages: 217 pages, 50 black & white tables, biography. BIC Classification: TDPB; TGPR; TJF; TJFD. Category: (G) General (US: Trade). Dimension: 235 x 155 x 12. Weight in Grams: 343.
- Format
- Paperback
- Publication date
- 2014
- Publisher
- Springer United States
- Edition
- 2011th Edition
- Number of pages
- 217
- Condition
- New
- SKU
- V9781489982117
- ISBN
- 9781489982117
Paperback
Condition: New
€ 181.61
€ 181.61
Paperback. This book evaluates strategies for future system design in multiprocessor system-on-chip (MPSoC) architectures. It examines both hardware design and integration of new development tools as well as novel trends in MPSoC design. Editor(s): Hubner, Michael; Becker, Jurgen. Num Pages: 278 pages, biography. BIC Classification: TJFC; UGC. Category: (G) General (US: Trade). Dimension: 235 x 155 x 15. Weight in Grams: 433.
- Format
- Paperback
- Publication date
- 2014
- Publisher
- Springer-Verlag New York Inc. United States
- Number of pages
- 278
- Condition
- New
- SKU
- V9781489982469
- ISBN
- 9781489982469
Paperback
Condition: New
€ 181.04
€ 181.04
Paperback. This book presents a novel approach for Architecture Description Language (ADL)-based instruction-set description that enables the automatic retargeting of the complete software toolkit from a single ADL processor model. Num Pages: 238 pages, 9 black & white tables, biography. BIC Classification: TJFC; UGC. Category: (G) General (US: Trade). Dimension: 235 x 155 x 13. Weight in Grams: 373.
- Format
- Paperback
- Publication date
- 2014
- Publisher
- Springer-Verlag New York Inc. United States
- Number of pages
- 238
- Condition
- New
- SKU
- V9781489984050
- ISBN
- 9781489984050
Paperback
Condition: New
€ 160.44
€ 160.44
Paperback. Examining energy flow in today's data centers, this book gives particular focus to the state-of-the-art thermal management approaches now being implemented across the globe. Future trends in computing hardware and their possible impacts are also examined. Editor(s): Joshi, Yogendra; Kumar, Pramod. Num Pages: 640 pages, 43 black & white tables, biography. BIC Classification: TGMB; THX; TJFC; TNK. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 36. Weight in Grams: 967.
- Format
- Paperback
- Publication date
- 2014
- Publisher
- Springer-Verlag New York Inc. United States
- Number of pages
- 640
- Condition
- New
- SKU
- V9781489987211
- ISBN
- 9781489987211
Paperback
Condition: New
€ 184.20
€ 184.20
paperback. This in-depth view of varied aspects of power electronic packaging systematically introduces design, assembly, reliability and failure analysis and materials selection, as well as covering the most advanced simulation and modeling techniques in the field. Num Pages: 594 pages, 80 black & white tables, biography. BIC Classification: PNFS; THRD; TJF. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 31. Weight in Grams: 926.
- Format
- Paperback
- Publication date
- 2014
- Publisher
- Springer United States
- Edition
- 2012th Edition
- Number of pages
- 594
- Condition
- New
- SKU
- V9781489987976
- ISBN
- 9781489987976
Paperback
Condition: New
€ 298.20
€ 298.20
Paperback. Assessing the major hurdles to be overcome in the design and use of assistive technologies in a number of fields, this interdisciplinary volume blends engineering, computer science and medicine and provides recommendations for improving these technologies. Editor(s): Oishi, Meeko Mitsuko K.; Mitchell, Ian M.; Loos, H. F. Machiel van der. Num Pages: 137 pages, biography. BIC Classification: MQW; TGM; TJFM; UYZG. Category: (G) General (US: Trade). Dimension: 236 x 156 x 15. Weight in Grams: 212.
- Format
- Paperback
- Publication date
- 2014
- Publisher
- Springer-Verlag New York Inc. United States
- Number of pages
- 137
- Condition
- New
- SKU
- V9781489989802
- ISBN
- 9781489989802
Paperback
Condition: New
€ 170.74
€ 170.74
paperback. This treatise is a comprehensive review of the highly active field of superconductivity, with particular emphasis on materials where the transition temperature exceeds 40 degrees K. It serves as the authoritative, comprehensive reference work in this field. Editor(s): Schrieffer, J.Robert. Num Pages: 660 pages, biography. BIC Classification: PHF; PHK; TJFD; TJFD5. Category: (G) General (US: Trade). Dimension: 254 x 178 x 34. Weight in Grams: 1237.
- Format
- Paperback
- Publication date
- 2014
- Publisher
- Springer United States
- Edition
- 2007th Edition
- Number of pages
- 660
- Condition
- New
- SKU
- V9781489990617
- ISBN
- 9781489990617
Paperback
Condition: New
€ 238.14
€ 238.14
Paperback. This exhaustive survey of advanced simulation methods for modeling nanoscale devices systematically covers both theoretical approaches and numerical solutions, links methodology with the type of device, and includes advice on state-of-the-art semiconductors. Editor(s): Vasileska, Dragica; Goodnick, Stephen M. Num Pages: 452 pages, 6 black & white tables, biography. BIC Classification: TJFC; UGC. Category: (G) General (US: Trade). Dimension: 235 x 155 x 23. Weight in Grams: 694.
- Format
- Paperback
- Publication date
- 2014
- Publisher
- Springer-Verlag New York Inc. United States
- Number of pages
- 452
- Condition
- New
- SKU
- V9781489992789
- ISBN
- 9781489992789
Paperback
Condition: New
€ 182.52
€ 182.52
Paperback. This book presents the theory, design methodology and fresh applications of integrated circuits for analog signal processing. It covers a wide variety of active devices, active elements and amplifiers, working in voltage mode, current mode and mixed mode. Editor(s): Tlelo-Cuautle, Esteban. Num Pages: 332 pages, 32 black & white tables, biography. BIC Classification: TJFC; TTBM. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 18. Weight in Grams: 510.
- Format
- Paperback
- Publication date
- 2014
- Publisher
- Springer-Verlag New York Inc. United States
- Number of pages
- 332
- Condition
- New
- SKU
- V9781489994578
- ISBN
- 9781489994578
Paperback
Condition: New
€ 160.53
€ 160.53
Paperback. This book describes a new design approach for energy-efficient, Domain-Specific Instruction set Processor (DSIP) architectures used in the wireless baseband domain. Shows how to reduce development costs and increase scalability. Includes case studies. Num Pages: 311 pages, 12 black & white tables, biography. BIC Classification: TJF; TJFC; UYF. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 17. Weight in Grams: 480.
- Format
- Paperback
- Publication date
- 2015
- Publisher
- Springer-Verlag New York Inc. United States
- Number of pages
- 311
- Condition
- New
- SKU
- V9781489994882
- ISBN
- 9781489994882
Paperback
Condition: New
€ 180.96
€ 180.96
Paperback. Dealing with the engineering aspects of the two emerging and intertwined fields of synthetic and systems biology, this book reflects the promise they hold to revolutionize the way molecular biology research, drug discovery, and bio-engineering are done. Editor(s): Koeppl, Heinz; Densmore, Douglas; Setti, Gianluca; di Bernardo, Mario. Num Pages: 415 pages, biography. BIC Classification: TJFC; UGC. Category: (G) General (US: Trade). Dimension: 235 x 155 x 22. Weight in Grams: 635.
- Format
- Paperback
- Publication date
- 2014
- Publisher
- Springer-Verlag New York Inc. United States
- Number of pages
- 415
- Condition
- New
- SKU
- V9781489995056
- ISBN
- 9781489995056
Paperback
Condition: New
€ 182.16
€ 182.16
Paperback. This volume discusses parametric resonance and its occurrence in mechanical systems including those found in road, air and seagoing vehicles. It introduces the root causes of PR as well as its mathematical interpretation via the Mathieu-Hill equation. Editor(s): Fossen, Thor I.; Nijmeijer, Henk. Num Pages: 330 pages, 14 black & white tables, biography. BIC Classification: GPFC; TGMD4; TJFM. Category: (G) General (US: Trade). Dimension: 235 x 160 x 18. Weight in Grams: 500.
- Format
- Paperback
- Publication date
- 2014
- Publisher
- Springer-Verlag New York Inc. United States
- Number of pages
- 330
- Condition
- New
- SKU
- V9781489996428
- ISBN
- 9781489996428
Paperback
Condition: New
€ 182.06
€ 182.06
Paperback. Here is a comprehensive examination of CMOS circuits for passive wireless microsystems. Covers design challenges, fundamental issues of ultra-low power wireless communications, radio-frequency power harvesting, and advanced design techniques, and more. Num Pages: 296 pages, biography. BIC Classification: TJFC; UGC. Category: (G) General (US: Trade). Dimension: 235 x 155 x 16. Weight in Grams: 462.
- Format
- Paperback
- Publication date
- 2014
- Publisher
- Springer-Verlag New York Inc. United States
- Number of pages
- 296
- Condition
- New
- SKU
- V9781489996558
- ISBN
- 9781489996558
Paperback
Condition: New
€ 181.09
€ 181.09