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Mechanical engineering & materials

Results 11181 - 11200 of 11959

Mechanical engineering & materials

Hardback. Balancing mathematical detail and physical principles, this volume shows how fundamental aspects of fluid and solid mechanics, soft matter, scaling laws, and synthetic biology can be used to realize micro- and nanoscale technological innovations. Editor(s): Chakraborty, Suman. Num Pages: 278 pages, biography. BIC Classification: PHD; TBN; TGMF. Category: (P) Professional & Vocational. Dimension: 241 x 164 x 21. Weight in Grams: 554.
Format
Hardback
Publication date
2011
Publisher
Springer-Verlag New York Inc. United States
Number of pages
278
Condition
New
SKU
V9781441996008
ISBN
9781441996008
Hardback
Condition: New

€ 194.85

Hardback. This book offers new insight into theoretical and practical aspects of metal electrodeposition, covering selection and use of metal coatings, deposition of metals and alloys, individual peculiarities, properties and structure of coatings, controls and more. Num Pages: 378 pages, 30 black & white tables, biography. BIC Classification: PNRH; TBN; TGBF; TGM. Category: (P) Professional & Vocational. Dimension: 242 x 162 x 27. Weight in Grams: 728.
Format
Hardback
Publication date
2011
Publisher
Springer-Verlag New York Inc. United States
Number of pages
378
Condition
New
SKU
V9781441996688
ISBN
9781441996688
Hardback
Condition: New

€ 284.97

Hardback. Tribology for Scientists and Engineers Editor(s): Nosonovsky, Michael; Kailas, Satish Vasu; Ingole, Sudeep Prabhakar; Lovell, Michael R.; Menezes, Pradeep L. Num Pages: 959 pages, 303 black & white illustrations, 223 colour illustrations, 54 black & white tables, biogr. BIC Classification: PHFC; TGBF. Category: (P) Professional & Vocational. Dimension: 166 x 243 x 58. Weight in Grams: 1566.
Format
Hardback
Publication date
2013
Publisher
Springer-Verlag New York Inc. United States
Number of pages
959
Condition
New
SKU
V9781461419440
ISBN
9781461419440
Hardback
Condition: New

€ 433.41

hardcover. This book surveys the degradation of implant materials, reviewing in detail such failure mechanisms as corrosion, fatigue and wear, along with monitoring techniques. Surveys common implant biomaterials, as well as procedures for implant retrieval and analysis. Editor(s): Eliaz, Noam. Num Pages: 516 pages, 36 black & white tables, biography. BIC Classification: MQW; PNNP; PNRH; TGBF; TGM. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 30. Weight in Grams: 950.
Format
Hardback
Publication date
2012
Publisher
Springer United States
Edition
2012th Edition
Number of pages
516
Condition
New
SKU
V9781461439417
ISBN
9781461439417
Hardback
Condition: New

€ 197.41

Hardback. This book covers reliability procedures for lasers and high speed electronics used in cell phones, satellites, data transmission systems and displays. Addresses reliability engineering, materials, reliability testing and electronic characterization. Editor(s): Ueda, Osamu; Pearton, Steve. Num Pages: 632 pages, 30 black & white tables, biography. BIC Classification: TGMT; TJFC; TJFD; TTBL. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 41. Weight in Grams: 1106.
Format
Hardback
Publication date
2012
Publisher
Springer-Verlag New York Inc. United States
Number of pages
632
Condition
New
SKU
V9781461443360
ISBN
9781461443360
Hardback
Condition: New

€ 374.48

Hardcover. Copper Wire Bonding Num Pages: 261 pages, 84 black & white illustrations, 20 colour illustrations, 36 black & white tables, biograp. BIC Classification: TDM; TDPD; TGXW. Category: (P) Professional & Vocational. Dimension: 242 x 158 x 20. Weight in Grams: 540.
Format
Hardback
Publication date
2013
Publisher
Springer-Verlag New York Inc. United States
Edition
2014th Edition
Number of pages
247
Condition
New
SKU
V9781461457602
ISBN
9781461457602
Hardback
Condition: New

€ 160.73

paperback. This book explores the thermodynamics of non-equilibrium processes in materials. It develops a general technique created in order to construct nonlinear evolution equations describing non-equilibrium processes, while also developing a geometric context. Num Pages: 311 pages, biography. BIC Classification: PHH; TGB; TGM; TGMB. Category: (G) General (US: Trade). Dimension: 235 x 155 x 17. Weight in Grams: 480.
Format
Paperback
Publication date
2014
Publisher
Springer United States
Edition
2011th Edition
Number of pages
311
Condition
New
SKU
V9781489981745
ISBN
9781489981745
Paperback
Condition: New

€ 282.65

Paperback. This book describes the methodology and application of physical and mathematical modeling to multi-phase flow phenomena in materials processing. The focus is on systems involving gas-liquid interaction, the most prevalent in current metallurgical processes. Num Pages: 423 pages, biography. BIC Classification: TBJ; TGM; TGMB. Category: (G) General (US: Trade). Dimension: 235 x 155 x 22. Weight in Grams: 646.
Format
Paperback
Publication date
2014
Publisher
Springer-Verlag New York Inc. United States
Number of pages
423
Condition
New
SKU
V9781489981844
ISBN
9781489981844
Paperback
Condition: New

€ 195.40

paperback. This text discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. It covers many topics, and it addresses specific failure modes in solder and conductive adhesives at great length. Num Pages: 217 pages, 50 black & white tables, biography. BIC Classification: TDPB; TGPR; TJF; TJFD. Category: (G) General (US: Trade). Dimension: 235 x 155 x 12. Weight in Grams: 343.
Format
Paperback
Publication date
2014
Publisher
Springer United States
Edition
2011th Edition
Number of pages
217
Condition
New
SKU
V9781489982117
ISBN
9781489982117
Paperback
Condition: New

€ 194.05

Paperback. This book surveys the degradation of implant materials, reviewing in detail such failure mechanisms as corrosion, fatigue and wear, along with monitoring techniques. Surveys common implant biomaterials, as well as procedures for implant retrieval and analysis. Editor(s): Eliaz, Noam. Num Pages: 528 pages, 36 black & white tables, biography. BIC Classification: MQW; PNNP; PNRH; TGBF; TGM. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 27. Weight in Grams: 801.
Format
Paperback
Publication date
2014
Publisher
Springer-Verlag New York Inc. United States
Number of pages
528
Condition
New
SKU
V9781489985699
ISBN
9781489985699
Paperback
Condition: New

€ 196.45

Paperback. Examining energy flow in today's data centers, this book gives particular focus to the state-of-the-art thermal management approaches now being implemented across the globe. Future trends in computing hardware and their possible impacts are also examined. Editor(s): Joshi, Yogendra; Kumar, Pramod. Num Pages: 640 pages, 43 black & white tables, biography. BIC Classification: TGMB; THX; TJFC; TNK. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 36. Weight in Grams: 967.
Format
Paperback
Publication date
2014
Publisher
Springer-Verlag New York Inc. United States
Number of pages
640
Condition
New
SKU
V9781489987211
ISBN
9781489987211
Paperback
Condition: New

€ 197.54

Paperback. Assessing the major hurdles to be overcome in the design and use of assistive technologies in a number of fields, this interdisciplinary volume blends engineering, computer science and medicine and provides recommendations for improving these technologies. Editor(s): Oishi, Meeko Mitsuko K.; Mitchell, Ian M.; Loos, H. F. Machiel van der. Num Pages: 137 pages, biography. BIC Classification: MQW; TGM; TJFM; UYZG. Category: (G) General (US: Trade). Dimension: 236 x 156 x 15. Weight in Grams: 212.
Format
Paperback
Publication date
2014
Publisher
Springer-Verlag New York Inc. United States
Number of pages
137
Condition
New
SKU
V9781489989802
ISBN
9781489989802
Paperback
Condition: New

€ 183.08

Paperback. Balancing mathematical detail and physical principles, this volume shows how fundamental aspects of fluid and solid mechanics, soft matter, scaling laws, and synthetic biology can be used to realize micro- and nanoscale technological innovations. Editor(s): Chakraborty, Suman. Num Pages: 278 pages, biography. BIC Classification: PHD; TDPB; TGM; TGMF. Category: (G) General (US: Trade). Dimension: 235 x 155 x 15. Weight in Grams: 433.
Format
Paperback
Publication date
2014
Publisher
Springer-Verlag New York Inc. United States
Number of pages
278
Condition
New
SKU
V9781489991362
ISBN
9781489991362
Paperback
Condition: New

€ 194.14

Paperback. This book covers the dynamics of lead screw drives with an emphasis on the role of friction. It identifies ways to prevent self-excited vibration by design. It includes several approaches to actively suppress vibration using robust control methodologies. Num Pages: 224 pages, biography. BIC Classification: GPFC; TGMD4; TGXT. Category: (G) General (US: Trade). Dimension: 235 x 155 x 12. Weight in Grams: 349.
Format
Paperback
Publication date
2014
Publisher
Springer-Verlag New York Inc. United States
Number of pages
224
Condition
New
SKU
V9781489992765
ISBN
9781489992765
Paperback
Condition: New

€ 194.14

paperback. This book offers new insight into theoretical and practical aspects of metal electrodeposition, covering selection and use of metal coatings, deposition of metals and alloys, individual peculiarities, properties and structure of coatings, controls and more. Num Pages: 395 pages, 30 black & white tables, biography. BIC Classification: PNRH; TBN; TGBF; TGM. Category: (G) General (US: Trade). Dimension: 235 x 155 x 21. Weight in Grams: 605.
Format
Paperback
Publication date
2014
Publisher
Springer United States
Edition
2011th Edition
Number of pages
395
Condition
New
SKU
V9781489996169
ISBN
9781489996169
Paperback
Condition: New

€ 283.45

Paperback. This volume discusses parametric resonance and its occurrence in mechanical systems including those found in road, air and seagoing vehicles. It introduces the root causes of PR as well as its mathematical interpretation via the Mathieu-Hill equation. Editor(s): Fossen, Thor I.; Nijmeijer, Henk. Num Pages: 330 pages, 14 black & white tables, biography. BIC Classification: GPFC; TGMD4; TJFM. Category: (G) General (US: Trade). Dimension: 235 x 160 x 18. Weight in Grams: 500.
Format
Paperback
Publication date
2014
Publisher
Springer-Verlag New York Inc. United States
Number of pages
330
Condition
New
SKU
V9781489996428
ISBN
9781489996428
Paperback
Condition: New

€ 194.62

Paperback. This book covers reliability procedures for lasers and high speed electronics used in cell phones, satellites, data transmission systems and displays. Addresses reliability engineering, materials, reliability testing and electronic characterization. Editor(s): Ueda, Osamu; Pearton, Stephen J. Num Pages: 632 pages, 30 black & white tables, biography. BIC Classification: TGMT; TJF; TJFC; TJFD; TTB; TTBL. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 33. Weight in Grams: 955.
Format
Paperback
Publication date
2013
Publisher
Springer-Verlag New York Inc. United States
Number of pages
632
Condition
New
SKU
V9781493901197
ISBN
9781493901197
Paperback
Condition: New

€ 373.86

Hardback. Num Pages: 339 pages, 58 black & white illustrations, 256 colour illustrations, 58 black & white tables, biogra. BIC Classification: TGMB; TJF; TJFC. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 21. Weight in Grams: 706.
Format
Hardback
Publication date
2014
Publisher
Springer-Verlag New York Inc. United States
Number of pages
339
Condition
New
SKU
V9781493915552
ISBN
9781493915552
Hardback
Condition: New

€ 195.46

paperback. Based on the best papers presented in the ASME in 2010-11 in the topics of Dynamic Systems and Control, Optimal Approaches in Nonlinear Dynamics and Acoustics, this book describes use of nonlinear approaches in a range of engineering and science problems. Editor(s): Jazar, Reza N.; Dai, Liming. Num Pages: 329 pages, 98 black & white illustrations, 146 colour illustrations, 7 black & white tables, biograp. BIC Classification: PBKQ; TGMD4; TJFM. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 18. Weight in Grams: 510.
Format
Paperback
Publication date
2016
Publisher
Springer-Verlag New York Inc. United States
Edition
Softcover reprint of the original 1st ed. 2014
Number of pages
329
Condition
New
SKU
V9781493945757
ISBN
9781493945757
Paperback
Condition: New

€ 194.22

Paperback. Copper wire bonding is now replacing gold across the electronics industry, but its metallurgical aspects are highly specialized. This guide combines comparative metallurgical data with full coverage of the methodology and the latest technical innovations. Num Pages: 261 pages, 84 black & white illustrations, 20 colour illustrations, 36 black & white tables, biograp. BIC Classification: TDPB; TGXW; TJFD. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 14. Weight in Grams: 409.
Format
Paperback
Publication date
2016
Publisher
Springer-Verlag New York Inc. United States
Edition
Softcover reprint of the original 1st ed. 2014
Number of pages
261
Condition
New
SKU
V9781493953493
ISBN
9781493953493
Paperback
Condition: New

€ 160.42

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